International. Samsung Electronics recently revealed two new silicon products specifically designed for future mobile devices that will make heavy use of video and artificial intelligence (AI) applications, as well as 5G communications.
Both the Premium Exynos 990 Mobile Processor and the next-generation ultra-fast Exynos Modem 5123 5G leverage the most advanced 7-nanometer (nm) process technology using extreme ultraviolet (EUV) to provide unprecedented performance and accelerated product development options for mobile device manufacturers.
"Milestones in technological advances are imminent all around us. 5G mobile technology is breaking new ground for communication and connection, while AI is poised to become an everyday tool for people around the world," noted Inyup Kang, President of System LSI Business at Samsung Electronics. Samsung's Exynos 990 and Exynos Modem 5123 are perfectly suited for high-volume 5G and AI applications, and are designed to help the world's most ambitious companies, large and small, achieve their goals of bringing new capabilities to their markets."
The Exynos 990's inclusion of an integrated Arm Mali-G77 GPU, the first premium GPU based on the new Valhall architecture, which improves graphics performance or power efficiency by up to 20 percent, enables new levels of mobile gaming and other graphics-intensive operations. This adds to an overall 20 percent performance increase from an extremely powerful and flexible three-cluster CPU fabric consisting of two powerful custom cores, two high-performance Cortex-A76 cores, and four low-power Cortex-A55 cores.
The Exynos 990 also makes ai in-device practical and useful, with a first-class dual-core neural processing unit (NPU) and an improved digital signal processor (DSP) that can perform more than ten trillion operations (TOP) per second.
The NPU enables AI located on a smartphone or other mobile platform, allowing data to be processed on the device, rather than passing through a network and server, for greater efficiency and security. This can also help enhance AI features such as facial recognition and scene detection for richer mobile experiences.
Next-generation mobile connectivity needs are addressed with the Exynos 5123 5G modem, one of the first 5G modem chips manufactured with a 7nm EUV process. It supports virtually all networks, from sub-6GHz and mmWave 5G spectrums to 2G GSM/CDMA, 3G WCDMA, TD-SCDMA, HSPA and 4G LTE, with excellent downlink speed across the board.
In 5G, with an aggregation of up to 8 carriers (8CA), the modem offers a maximum downlink speed of up to 5.1 gigabits per second (Gbps) in sub-6 gigahertz (GHz) and 7.35Gbps in mmWave, or up to 3.0Gbps in 4G networks by supporting 1024 higher-order Quadrature Amplitude Modulation (QAM).
