International. Siemens AG and Intel Corporation announced the signing of a Memorandum of Understanding (MoU) to collaborate on driving the digitalization and sustainability of microelectronics manufacturing. The companies will focus on advancing future manufacturing efforts, evolving factory operations and cybersecurity, and supporting a resilient global industrial ecosystem.
"Semiconductors are the lifeblood of our modern economies. Few things work without chips. Therefore, we are proud to collaborate with Intel to rapidly advance semiconductor production. Siemens will bring its entire state-of-the-art portfolio of IoT-enabled hardware, software and electrical equipment to this collaboration," said Cedrik Neike, CEO of Digital Industries and member of the board of management of Siemens AG. "Our joint efforts will contribute to achieving global sustainability goals."
Cedrik Neike, CEO of Digital Industries and member of the board of directors of Siemens AG and Keyvan Esfarjani, chief operating officer of Intel Corp.
The MoU identifies key areas of collaboration to explore a range of initiatives, including optimising energy management and addressing carbon footprints across the value chain. For example, the collaboration will explore the use of "digital twins" of complex, capital-intensive manufacturing facilities to standardize solutions where every percentage of efficiency achieved is significant.
The collaboration will also explore minimizing energy use through advanced models of natural resources and environmental footprints across the value chain. To learn more about product-related emissions, Intel will explore product and supply chain-related modeling solutions with Siemens that drive data-driven insights and help the industry accelerate progress in reducing its collective footprint.
