International. HID Global, a global leader in secure identification solutions, announced the launch of an ultra-thin pre-laminated polycarbonate inlay for electronic identification on electronic identification cards (e-ID), which is more than 30% thinner than other alternatives.
The new offering is the first inlay by HID Global to use its patented direct join technology, which is available for high frequency (HF) systems. NXP Semiconductors is the first qualified HID Global business partner to offer IC chips for this product.
HID Global's new inlay takes advantage of its renowned process whereby chips are directly attached to copper antennas incorporated with air coil, for low-frequency applications in animal identifications and in the automotive industry, without having to add bulky modules.
The company has successfully leveraged its direct joining technology in HF applications, thus enabling manufacturers to develop the smallest such formats on the market, while delivering exceptional performance. By using this method in its new ultra-thin inlays, HID Global provides smart cards with a durable and reliable connection between the card's intelligence – the IC chip – and its antenna.
"With this new ultra-thin inlay, we continue to expand the unmatched capabilities of our government solutions, while at the same time giving smart card manufacturers around the world the ability to expand the range of products they can offer their customers," said Rob Haslam, Vice President, Government Identification Solutions, HID Global. "This is also a testament to the strong collaboration between HID Global and NXP, two companies that share the goal of ensuring the highest quality and reliability in embeddings to deliver secure and protected smart cards over the long term."
In addition, the new inlay, which has a smaller thickness, offers manufacturers of e-ID cards and smart cards greater flexibility in the manufacture of the cards. The compact dimensions of HID Global's ultra-thin inlays (200 microns, instead of the traditional 350 microns) allow manufacturers more space to incorporate more security features on both sides of an e-ID card during manufacturing, while meeting international ISO thickness standards.
"This is an important step in our joint goal of providing smart card manufacturers with the thinnest, most durable, reliable and flexible embedding solutions for today's high-frequency smart card solutions, which have a very small footprint," said Ulrich Huewels, senior vice president and general manager, Secure Identification Solutions, NXP Semiconductors. "Working with an innovative company like HID Global ensures that our market-leading security microcontrollers are available in versatile presentations so they can be used in a wide range of smart card applications."
NXP Semiconductors managed to certify its SmartMX2 P60D080 microcontroller IC chip for inclusion in HID Global's new ultra-thin inlay with pre-laminated polycarbonate for electronic identifications, which is well suited to HID's direct joining technology. Additionally, the companies came together to create a special Megabump design that will enhance the benefits of the direct joining process (patent pending) and offer customers a solution that can be implemented in many ID card solutions.
HID Global's ultra-thin, pre-rolled polycarbonate scale solution for electronic identifications is now available in Latin America.
